| Date | Announcement |
| 2026/04/07 | Website Launch |
The 31st International Electron Devices and Materials Symposium (IEDMS 2026) will be held at the Chang Yung-Fa Foundation (張榮發基金會) in Taipei, Taiwan, from October 22 to 23, 2026. IEDMS is a well-established and prestigious conference in the field of semiconductor materials and devices, with a strong track record of successful annual events in Taiwan over the past several decades.
This year, the symposium is hosted by National Taiwan University (NTU) and sponsored by the Electronics Devices and Materials Association, and the National Science and Technology Council. IEDMS provides an international platform for scientists, engineers, and researchers to present and exchange the latest advances, ideas, and applications in electron devices and materials, fostering collaboration and innovation in this rapidly evolving field.
Topics include emerging devices, logic technology, memory technology, and related device innovations.
The symposium welcomes work on high-frequency devices and circuits, power devices, and compound semiconductor technology.
Research in novel materials, MEMS, sensors, and bio-related technologies is invited across academia and industry.
IEDMS 2026 also highlights photonics devices and heterogeneous integration technologies for next-generation applications.
Prospective authors are kindly invited to submit formatted 2-page abstracts, including results, figures, tables, and references. All submissions will undergo peer review and be evaluated based on originality, technical soundness, and clarity.
Important milestones:
Submission Deadline: July 31, 2026
Notification of Acceptance: Sept. 15,
2026
Early-Bird Registration Deadline: Sept. 30,
2026
Submission template:
Please prepare your abstract using the official IEDMS 2026 submission template.
Paper template download:
MS Word: Template
Download
The Technical Program Committee invites submissions in, but not limited to, the following areas:
Novel processes and devices (Si, SiGe, Ge, 2D) for low power logic, memories, and associated characterization, modeling, simulation and reliability
Material growth, high-speed devices/circuits, power devices/circuits, associated characterization, modeling, simulation and reliability
Material preparation, thin-film transistors, energy-conversion devices, solar cells, spintronics, MEMS, sensor and thermoelectric devices, associated characterization, modeling, simulation, and reliability
Lasers, light-emitting diodes, photodetectors, organic electronics, waveguides, Si-photonics, integration, and 3D ICs
Hosted and supported by the key organizations behind IEDMS 2026.
