Important Notice

IEDMS 2026 – Typhoon Contingency Policy

If the Taipei City Government announces a suspension of work and classes due to severe weather on October 22 or 23, 2026, all in-person conference activities on the affected day will be suspended. Activities on the unaffected day will proceed as scheduled, provided that conditions are safe.

The safety of all conference participants, speakers, exhibitors, and staff is our highest priority. If the Taipei City Government announces a suspension of work and classes due to a typhoon or other severe weather conditions on October 22 or 23, 2026, all in-person conference activities scheduled for the affected day will be suspended. Activities on the unaffected day will proceed as scheduled, provided that conditions are safe. The Organizing Committee will announce alternative arrangements for affected presentations and conference activities, including possible online presentations or rescheduling. All updates will be posted on the official IEDMS 2026 website and communicated to registered participants by email. We appreciate your understanding and cooperation.

Updated: · Taiwan time (UTC+8)

Latest Updates

Date Announcement
2026/10/19 IEDMS 2026 – Typhoon Contingency Policy
2026/09/28 The poster board layouts for Poster Discussion I & II have been released.
2026/09/19 The agenda is Released.
2026/08/07 The submission deadline has been extended to Aug. 16, 2026 and would not be extended further.
2026/07/31 The submission deadline has been extended to Aug. 7, 2026.
2026/04/07 Website Launch
 
 
 

 

Important Dates
  • Submission Deadline:
    July 31, 2026 Aug. 16, 2026
  • Notification of Acceptance: Sept. 15, 2026
  • Early-Bird Registration Deadline: Oct. 7, 2026
Annual Achievements Presentation of Micro-Electronics Engineering Division of NSTC
Date: 2026.10.23 (Fri.)
Time: 13:00 - 16:00
Meeting Room: 1001
Poster Display Rooms: 1103, 1110A & 1110B



Conference Overview

The 31st International Electron Devices and Materials Symposium (IEDMS 2026) will be held at the Chang Yung-Fa Foundation (張榮發基金會) in Taipei, Taiwan, from October 22 to 23, 2026. IEDMS is a well-established and prestigious conference in the field of semiconductor materials and devices, with a strong track record of successful annual events in Taiwan over the past several decades.

This year, the symposium is hosted by National Taiwan University (NTU) and sponsored by the Electronics Devices and Materials Association, and the National Science and Technology Council. IEDMS provides an international platform for scientists, engineers, and researchers to present and exchange the latest advances, ideas, and applications in electron devices and materials, fostering collaboration and innovation in this rapidly evolving field.

Emerging Devices

Topics include emerging devices, logic technology, memory technology, and related device innovations.

High Frequency & Power

The symposium welcomes work on high-frequency devices and circuits, power devices, and compound semiconductor technology.

Materials, MEMS & Bio

Research in novel materials, MEMS, sensors, and bio-related technologies is invited across academia and industry.

Photonics Integration

IEDMS 2026 also highlights photonics devices and heterogeneous integration technologies for next-generation applications.

Topics of Interest

The Technical Program Committee invites submissions in, but not limited to, the following areas:

A. Emerging Devices, Logic, and Memory Technologies

Novel processes and devices (Si, SiGe, Ge, 2D) for low power logic, memories, and associated characterization, modeling, simulation and reliability

B. High-Frequency and Power Devices, and Compound Semiconductor Technologies

Material growth, high-speed devices/circuits, power devices/circuits, associated characterization, modeling, simulation and reliability

C. Novel Materials, MEMS, Sensors, and Bio Technologies

Material preparation, thin-film transistors, energy-conversion devices, solar cells, spintronics, MEMS, sensor and thermoelectric devices, associated characterization, modeling, simulation, and reliability

D. Photonic Devices and Heterogeneous Integration Technologies

Lasers, light-emitting diodes, photodetectors, organic electronics, waveguides, Si-photonics, integration, and 3D ICs

Conference Organizer

Hosted and supported by the key organizations behind IEDMS 2026.