The Taipei City Government has announced a suspension of work and classes on October 23, 2026 due to severe weather. Presentations scheduled for October 23 will be held online. Please visit the Agenda page and click Join Online under your session to access the online meeting. Further details will be sent by email.
The safety of all conference participants, speakers, exhibitors, and staff is our highest priority. Following the Taipei City Government's announcement of a suspension of work and classes on October 23, 2026 due to severe weather, presentations scheduled for that day will be held online. To access the online meeting, please visit the Agenda page and click Join Online under your session. Further details will be sent to registered participants by email. We appreciate your understanding and cooperation.
Updated: · Taiwan time (UTC+8)
| Date | Announcement |
| 2026/10/22 | IEDMS 2026 – October 23 Presentations Will Be Held Online |
| 2026/09/28 | The poster board layouts for Poster Discussion I & II have been released. |
| 2026/09/19 | The agenda is Released. |
| 2026/08/07 | The submission deadline has been extended to Aug. 16, 2026 and would not be extended further. |
| 2026/07/31 | The submission deadline has been extended to Aug. 7, 2026. |
| 2026/04/07 | Website Launch |
The 31st International Electron Devices and Materials Symposium (IEDMS 2026) will be held at the Chang Yung-Fa Foundation (張榮發基金會) in Taipei, Taiwan, from October 22 to 23, 2026. IEDMS is a well-established and prestigious conference in the field of semiconductor materials and devices, with a strong track record of successful annual events in Taiwan over the past several decades.
This year, the symposium is hosted by National Taiwan University (NTU) and sponsored by the Electronics Devices and Materials Association, and the National Science and Technology Council. IEDMS provides an international platform for scientists, engineers, and researchers to present and exchange the latest advances, ideas, and applications in electron devices and materials, fostering collaboration and innovation in this rapidly evolving field.
Topics include emerging devices, logic technology, memory technology, and related device innovations.
The symposium welcomes work on high-frequency devices and circuits, power devices, and compound semiconductor technology.
Research in novel materials, MEMS, sensors, and bio-related technologies is invited across academia and industry.
IEDMS 2026 also highlights photonics devices and heterogeneous integration technologies for next-generation applications.
The Technical Program Committee invites submissions in, but not limited to, the following areas:
Novel processes and devices (Si, SiGe, Ge, 2D) for low power logic, memories, and associated characterization, modeling, simulation and reliability
Material growth, high-speed devices/circuits, power devices/circuits, associated characterization, modeling, simulation and reliability
Material preparation, thin-film transistors, energy-conversion devices, solar cells, spintronics, MEMS, sensor and thermoelectric devices, associated characterization, modeling, simulation, and reliability
Lasers, light-emitting diodes, photodetectors, organic electronics, waveguides, Si-photonics, integration, and 3D ICs
Hosted and supported by the key organizations behind IEDMS 2026.
We thank the organizations supporting IEDMS 2026.
